Microelectronics

In order to maximize the life of reverse osmosis membranes, it is highly recommended to use a filter in front of the membrane with the goals of reducing the risk of fouling the membrane. Membrane fouling is the main cause of permeate flux decline and loss of product quality in reverse osmosis systems. Silt Density Index or SDI (ASTM standard test method D 4189-82), is the empirical test developed for measuring the potential rate of fouling of RO membranes

Chemical vapor deposition (CVD) is a vacuum deposition method generally used for depositing crystalline micro/nano thin films and structures on wafers using materials such as silicon, carbon, fluorocarbons, tungsten and titanium nitride. Metal organic chemical vapor deposition (MOCVD), a variant of CVD, is most commonly used for the production of red, blue, green and white LEDs

This broad category includes devices such as transistors, capacitors, resistors, diodes, LED and photocells. The different types of devices can be integrated together to form integrated circuits, or VLSI (Very Large Scale Integration) devices such as microprocessors and random access memory (RAM).

CMP is a process used for smoothing the surfaces of semiconductor wafers using a combination of chemical and mechanical forces. The process uses chemical etching and abrasive polishing to achieve a flat surface.

Polishing of wafers is typically accomplished using a process called Chemical Mechanical Planarization, which uses a combination of chemical etching and abrasive polishing to achieve a flat surface.

This is essentially the same as a microprocessor, an integrated circuit that behaves as the brain of the computer. Also referred to as the central processing unit, or CPU.

A microprocessor is an integrated circuit, but not all integrated circuits are microprocessors. This acts as the brains, being able to process logical and arithmetic instructions that are programmed into it.

Copper and other metals are used as conductors in printed circuit boards. But for microelectronic devices it is difficult to properly control the electric signal and thus semiconductor material such as silicon is used which also insulates better.